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Schnelle IR-Lumineszenzdiode High Speed Infrared Emitter SFH 4000
Wesentliche Merkmale * Hohe Ausgangsleistung: 35mW * Sehr kleines Gehause: (LxBxH) 1,7 mm x 0,8 mm x 0,65 mm * Sehr kurze Schaltzeiten (10ns) * Hohe Impulsbelastbarkeit * IR Reflow Loten geeignet * Gegurtet lieferbar Anwendungen * Miniaturlichtschranken fur Gleich- und Wechsellichtbetrieb, Lochstreifenleser * Industrieelektronik * Messen/Steuern/Regeln" * Sensorik * Alarm- und Sicherungssysteme * IR-Freiraumubertragung Typ Type SFH 4000
1)
Features * High output power: 35mW * Very small package: (LxWxH) 1.7 mm x 0.8 mm x 0.65 mm * Very short switching times (10ns) * High pulse handling capability * Suitable for IR reflow soldering * Available on tape and reel Applications * * * * * * Miniature photointerrupters Industrial electronics For drive and control circuits Sensor technology Alarm and safety equipment IR free air transmission
Bestellnummer Ordering Code Q62702P5524
Strahlstarkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant intensity grouping 1) Ie (mW/sr) > 1.6 (typ. 4.4)
gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr
2004-01-28
1
SFH 4000
Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlastrom Forward current Stostrom, = 10 s, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value - 40 ... + 100 3 100 2.2 180 450 Einheit Unit C V mA A mW K/W
Top; Tstg VR IF IFSM Ptot
Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each Warmewiderstand Sperrschicht - Lotstelle bei RthJS Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block
250
K/W
2004-01-28
2
SFH 4000
Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 m A Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimensions of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Kapazitat, Capacitance VR = 0 V, f = 1 MHz Durchlaspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Sperrstrom, Reverse current VR = 3 V Gesamtstrahlungsflu, Total radiant flux IF = 100 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. e, Symbol Symbol peak Wert Value 950 Einheit Unit nm
40
nm
80 0.09 0.3 x 0.3 10
Grad deg. mm2 mm ns
A LxB LxW tr, tf
Co
15
pF
VF VF IR
1.5 ( 1.8) 3.2 ( 4.3) 0.01 ( 1)
V V A
e
35
mW
TCI
- 0.44
%/K
IF = 100 mA
Temperature coefficient of Ie or e, IF = 100 mA
Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA
2004-01-28
TCV TC
- 1.5 + 0.2
mV/K nm/K
3
SFH 4000
Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Symbol Ie min Ie typ Ie typ Werte Values 1.6 4.4 20 Einheit Unit mW/sr mW/sr mW/sr
2004-01-28
4
SFH 4000
Relative Spectral Emission Irel = f ()
100
OHF00777
Radiant Intensity
e = f (IF) e 100 mA
OHF00809
Single pulse, tp = 20 s
10 2 e e (100 mA)
Max. Permissible Forward Current IF = f (TA) 2004-01-28
120
OHR00883
erel
80
F mA
100
80
60
10 0
60
R thjA = 450 K/W
40
10 -1
40
20
10 -2
20
0
800 850
900
950 1000
nm 1100
10 -3 10 0
10 1
10 2
10 3 mA 10 4 F
0
0
20
40
60
80
100 C 120 TA
IF = f (VF) single pulse, tp = 20 s
10 4 mA 10 3 10 2 10 1
OHF00784
Forward Current
Permissible Pulse Handling Capability IF = f (), TA = 25 C, duty cycle D = parameter
IF
10 1 A 5
OHF00040
F
P D= T
t
tP
IF T D=
0.005 0.01 0.02 0.05 0.1 0.2 0.5 1
10 0
10
0
5
10 -1 10 -2 10 -3
0 0.5 1 1.5 2 2.5 3 3.5
V 4.5
10 -1 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2
VF
tp
Radiation Characteristics Irel = f ()
40 30 20
10
0 1.0
OHF00614
50 0.8 60
0.6
70
0.4
80 90
0.2 0
100
1.0
0.8
0.6
0.4
0
20
40
60
80
100
120
2004-01-28
5
SFH 4000
Mazeichnung Package Outlines
0.8 (0.031) 0.1 (0.004)
(0.002) 0.125 (0.005) +0.05(0.001) -0.03
1.7 (0.067) 0.1 (0.004)
0.3 (0.012)
Package marking
Package marking
(0.001) 0.65 (0.026) +0.02(0.002) -0.05
GPLY6089
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Package Colour
Epoxy, SmartLED (SCD 80) colourless, light diffused
Package marking Anode
2004-01-28
6
1.3 (0.051) 0.1 (0.004)
7 max
5
SFH 4000
IR-Reflow Lotprofil (nach IPC 9501) IR Reflow Soldering profile (acc. to IPC 9501)
250 C
OHLA0685
Tmax = 245 C
T
200
T = 183 C
t = 70 s
150 2-3 K/s 100 2-3 K/s 50
0 0:00 0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 min 5:30
t
Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2004-01-28 7

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